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SMT Reflow Soldering

Reflow Ovens

From compact tabletop batch ovens to fully convection inline production systems, compare the SMTmax reflow lineup by board size, production method and throughput requirements.

Start tabletop. Scale to inline production.

The AS-5010, AS-5080 and AS-6070 provide progressively larger tabletop working areas for prototypes and batch assembly. The AE-F600C and WP-8800 move into conveyorized fully convection processing for continuous SMT production.

Choosing the right oven depends on PCB size, solder paste profile, production volume and whether your process is batch or inline.

Compare the SMTmax Reflow Oven Lineup

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AS-5010 Tabletop Reflow Oven Compact

AS-5010

Reflow Oven

Compact batch reflow oven for prototypes, labs, repair work and small PCB production.

Tabletop batchSystem Type
250 × 200 mmBoard / Conveyor
IR + hot air circulationHeating
1,600 W maxPower
AS-5080 Tabletop Reflow Oven Popular Tabletop

AS-5080

Reflow Oven

Larger tabletop reflow platform with more board capacity while keeping a compact batch-production format.

Tabletop batchSystem Type
350 × 300 mmBoard / Conveyor
IR + hot air circulationHeating
2,400 W maxPower
AS-6070 Tabletop Reflow Oven Large Tabletop

AS-6070

Reflow Oven

Large-format tabletop reflow oven for users who need more batch area without moving to an inline conveyor system.

Tabletop batchSystem Type
500 × 400 mmBoard / Conveyor
IR + hot air circulationHeating
3,600 W maxPower
AE-F600C 3-Zone Convection Reflow Oven Production Inline

AE-F600C

Reflow Oven

Compact conveyorized 3-zone convection reflow oven with touchscreen control and built-in thermal profiling support.

3-zone inline convectionSystem Type
10 in max PCB widthBoard / Conveyor
3 independent zonesHeating
~12.5 kWPower
WP-8800 Fully Convection Reflow Oven High Capacity

WP-8800

Reflow Oven

High-capacity inline reflow platform with eight top and eight bottom heating zones and a wide conveyor system.

Inline convectionSystem Type
600 mm conveyorBoard / Conveyor
8 top + 8 bottom zonesHeating
220 V 3-phasePower
Side-by-side

Tabletop vs. Inline Reflow Ovens

SpecificationAS-5010AS-5080AS-6070AE-F600CWP-8800
System typeTabletop batchTabletop batchTabletop batch3-zone inline convectionInline convection
Heating platformIR + hot air circulationIR + hot air circulationIR + hot air circulation3 independent zones8 top + 8 bottom zones
Working area / conveyor250 × 200 mm350 × 300 mm500 × 400 mm10 in max PCB width600 mm conveyor
Power1,600 W max2,400 W max3,600 W max~12.5 kW220 V 3-phase
Best suited forPrototyping & small boardsSmall-batch SMT assemblyLarger batch boardsSmall-to-medium inline productionHigher-volume production

Which Reflow Oven Fits Your Process?

1

AS-5010

Choose the smallest tabletop platform for compact boards, prototyping, repair and lower-volume reflow work.

2

AS-5080

Step up when you want more board area in a tabletop format while keeping the process simple and batch based.

3

AS-6070

Use the largest tabletop model when board size is the priority but an inline conveyor system is not yet required.

4

AE-F600C

Move to continuous fully convection processing when production requires conveyorized inline reflow and computerized control.

5

WP-8800

Choose the larger inline platform for wider boards and higher-volume production with extensive multi-zone heating control.

Need help matching an oven to your PCB?

Send SMTmax your PCB dimensions, solder paste profile and production requirements. We can help identify the appropriate reflow platform.

Request a Reflow Oven Quote →